| ●Features |
| ■ Ready for wafers ranging from 3” to 12” in size, plus non-wafer items. |
| ■ Low-cost transfer machine best suited for R&D process equipment |
| ■ Unit architecture for short-time delivery |
| ■ Minimum footprint available for a φ300-mm-wafer transfer machine |
| ■ Confined to a minimum set of necessary functions to ease both setups and operations |
| ■ Broad selection of options available to meet many, diverse applications (under development) |
| ■ Available in two types: the all-in-one type, which can be commissioned into service instantly by simply hooking up utilities toit, and the simple type, which offers a flexible solution to the need for platform development support equipment. |
